Solder Paste
SOLDER PASTE
Micron Solder Powder
PRODUCT SELECTION
DETAILED INTRODUCTION
PRODUCT LIST

Features and Benefits

·  Applied to 0.3mm picth bonding pad.

·  Type 5 solder powder (10~25 µm) can be used for 0402 components soldering.

·  Excellent printability.

·  Good heat-resistance and wetting properties.


Applications

Smartphone, Smartwatch.

PRODUCT LIST
Alloy
Size
Features&Application
Sn-3Ag-0.5Cu Sn-1Ag-0.5Cu Sn-0.3Ag-0.8Cu Type5(15~25um)/Type6(5~15um) /
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type5(15~25um)/Type6(5~15um) /
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